BoxCanyon-DC3217BY
Integrated Board
- Campers Lake (D33217CK)
Dimensions
- 116.6mm x 112.0mm x 39.0mm
- 4.59" x 4.41" x 1.55"
Intel Xeon Phi Coprocessor 5110P
Extracting extreme performance from highly-parallel applications just got easier—much easier. The Intel® Xeon Phi™ coprocessor 5110P, based on Intel® Many Integrated Core (MIC) architecture, complements the industryleading performance and energy-efficiency of the Intel® Xeon® processor E5 family to enable dramatic performance gains for some of today's most demanding applications. You can now achieve optimized performance for even your most highly-parallel technical computing workloads, while maintaining a unified hardware and software environment.1
Intel® Server System H2312WPFJR
The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
Intel® Server System H2312WPJR
The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
Intel® Server System H2312WPKR
The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
Intel® Server System H2312WPQJR
The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
Intel® Server System H2312WPQKR
The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
Intel® Server System R1208GZ4GC
The Intel® Server System R1200GZ family takes full advantage of the new Intel® Xeon® processor E5-2600 product family capabilities with the Intel® Server Board S2600GZ family. The Intel Server System R1200GZ features an energy-efficient spread core design and maximum (768 GB) memory capacity with up to 24 DIMMs. S2600GZ-based rack-optimized server systems deliver unmatched performance, I/O capacity, and flexibility in an expansive family of 1U and 2U systems for the most demanding enterprise data center, cloud, or HPC environments.
Intel® Server System R1208GZ4GCSAS
The Intel® Server System R1200GZ family takes full advantage of the new Intel® Xeon® processor E5-2600 product family capabilities with the Intel® Server Board S2600GZ family. The Intel Server System R1200GZ features an energy-efficient spread core design and maximum (768 GB) memory capacity with up to 24 DIMMs. S2600GZ-based rack-optimized server systems deliver unmatched performance, I/O capacity, and flexibility in an expansive family of 1U and 2U systems for the most demanding enterprise data center, cloud, or HPC environments.
Intel® Server System R1208GZ4GS9
The Intel® Server System R1200GZ family takes full advantage of the new Intel® Xeon® processor E5-2600 product family capabilities with the Intel® Server Board S2600GZ family. The Intel Server System R1200GZ features an energy-efficient spread core design and maximum (768 GB) memory capacity with up to 24 DIMMs. S2600GZ-based rack-optimized server systems deliver unmatched performance, I/O capacity, and flexibility in an expansive family of 1U and 2U systems for the most demanding enterprise data center, cloud, or HPC environments.
Intel® Server System R1304BB4DC
Chassis Dimensions | 1.75"x17.2"x24.75" |
Board Form Factor | Custom 13.5'' x 13.5'' |
Rack Rails Included | Yes |
Socket | Socket B2 |
Target Market | Cloud/Datacenter |
Intel® Server System R1304BTLSHBN
- Supports Intel® Xeon® processor E3 1200 and E3 1200 v2 product family (including lower power processors)
- Space-saving 21.8” chassis depth
- One half height PCI Express* 3.0 x 8 through riser card
- Supports up to four hot-swap HDDs