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Intel® Server System H2312WPJR


  • Two 1200W or 1600W Platinum Efficiency common redundant power supplies
  • 12 3.5" hot-swap hard drives
  • Hot-swappable 4-node system featuring four Intel® Server Board S2600WP
  • Supports the new Intel® Xeon® processor E5-2600 product family
  • Maximum 64 memory sockets support LR/U/R-DIMMs for maximum memory density at up to 1600MHz (16 per board)
  • Pluggable carrier trays with cable-free power for easy serviceability
  • Three high-speed 40mm fans per node for individual node-level cooling
  • Maximum 16 PCIe* Gen3 x16 slots (four per board)
  • Intel® I/O Expansion Module and Intel® Remote Management Module 4 (Intel® RMM4) supported
  • Models with or without integrated QDR/FDR Infiniband*

Density- and Performance-Optimized HPC Solution Supporting Large Memory Footprint

The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.

The Intel® Server System H2300WP family makes use of several key new Intel® Server Board technology innovations. The Intel® Advanced Management Technology1 helps simplify and optimize system management for higher capacity and more secure platform management. Intel® Quiet Thermal Technology enhancements, including Advanced Thermal Sensor Array and Thermal Trip Shutdown, provide thermal and acoustic management to reduce unnecessary noise and provide cooling flexibility while maximizing system efficiency. This board also makes use of power delivery enhancements from the Intel® Efficient Power Technology, to help improve power efficiency and reliability.

Technical Specifications




Chassis form factor 2U Rack
Chassis dimensions 3.5'' x 17.2'' x 30.5''
Socket Socket R
Max CPU configuration 8
Rack-friendly board Yes
Power supply 1200W AC Common Redundant Power Supply (Platinum Efficiency)
Power supply type AC
# of power supply 8
Redundant fans Not Supported
Redundant power Supported
Heat sink included Yes
Backplanes Included
Included items Integrated 2U 4Nodes server system including (4) Intel(r) Server Board S2600WP, (4) Bridge Board, (4) Node Power Board, (4) PCIe x16 Riser Card, (8) 1U Passive 84mm x 106mm Heat Sink, (12) 4056 Dual Rotor Fan, (4) Air Duct, (4) 1U Node Tray, (1) 3.5'' SATA/SAS Backplane to support 12x 3.5" Hot-Swap HDD, (12) 3.5'' Drive Carriers, (2) 1200W Common Redundant Power Supply (Platinum Efficiency), (2) Power Distribution Boards, Value Rails
# of 3.5" hard drives 12
3.5" hard drive support Supports 12 hot-swap 3.5" or 2.5" SATA 3G drives standard, SAS 3G with activation key/discrete controller
Intel® Server Management Software Yes

Memory Specifications

Memory types DDR3 ECC UDIMM 1333, RDIMM 1600, LRDIMM 1333
# of DIMMs 64
Max memory size (dependent on memory type) 2048 GB

Graphics Specifications

Integrated graphics Yes

Expansion Options

PCIe* x16 Gen 3 4
Intel® I/O Expansion Module PCIe* x8 Gen 3 4

I/O Specifications

# of USB ports 20
# of SATA ports 20
RAID configuration Software RAID 1,0,10 optional 5
# of serial ports 4
Integrated LAN 8x 1GbE
# of LAN ports 8
Integrated SAS ports 12
Integrated InfiniBand* No

Advanced Technologies 

Intel® Remote Management Module support Yes
Integrated BMC with IPMI IPMI 2.0
Intel® Trusted Platform Module (Intel® TPM) version 1.2
Intel® Intelligent Power Node Manager Yes
Intel® On-Demand Redundant Power Yes

Intel® Server Board technology innovations

Intel® Advanced Management Technology All capabilities
Intel® Efficient Power Technology Power delivery
Intel® Quiet Thermal Technology Advanced thermal sensor array, thermal trip shutdown
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4 Scar Bank, Warwick, CV34 5DB, United Kingdom.

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