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HP Partner

TYAN Micro Server FM65-B5519

Features

  • Most Cost-Effective, High-Density Server Platform
  • (18) Intel single-socket Xeon E3-1200 or i3-2100 (32nm / 22nm) blades in a 4U enclosure
  • (8) Rear mounted hot-swap chassis cooling fans
  • 80-PLUS Platinum hot-swappable (2+1) redundant power supply with up to 1600W shared amongst all blades
  • Each blade features:
  • - Support for (1) Intel Sandy Bridge / Ivy Bridge Xeon E3-1200 or i3-2100 (32nm / 22nm) series processor up to 45W
  • - Intel C202 Chipset (Cougar Point)
  • - (4) DIMM Slots, up to 32GB U-DDR3 1333/1066 with ECC memory - (2) fixed 2.5" SATA-II HDD

Technical Specifications

 
System Form Factor 4U Rackmount Frame w/ 18x Blades
  Gross Weight 55 kg
  Feature (18) Compute nodes & (1) Pass through module in one chassis
  Chassis Model FT68
  Dimension (D x W x H 25.6" x 17.32" x 7.17" (650 x 440 x 175.7mm)
  Blade Dimension (D x W x H) 14.13" x 5.07" x 1.1" (358.8 x 128.88 x 28mm)
  Motherboard S5519GM2N
  Board Dimension SSI Micro Module Server (118.8 x 263.5mm)
Front Panel (per blade) I/O Ports (2) USB ports / (1) D-Sub 15 pin port / (1) RJ-45 port from Pass through module
Internal Drive Bay (per blade) Type / Q'ty (2) 2.5" fixed
  Supported HDD Interface SATA-II 3.0Gb/s / height: 9mm
Processor (per blade) Supported CPU Series Intel Xeon E3-1200, i3-2100 (32nm / 22nm) series processors
  Socket Type / Q'ty LGA 1155/ (1)
  Thermal Design Power (TDP) wattage Max up to 45W
Chipset (per blade) PCH Intel C202
Memory (per blade) Supported DIMM Qty (4) DIMM slots
  DIMM Type / Speed DDR3 VLP ECC 1066/1333 UDIMM / DDR3 VLP ECC 1066/1333/1600 UDIMM
  Capacity Up to 32GB
  Memory channel 2 Channels per CPU
  Memory voltage 1.5V
LAN (per blade) Port Q'ty (2)
  Controller Intel 82574L
Storage (per blade)
SATA Connector
Controller
Speed
(2) SATA
Intel C202
3.0 Gb/s
Graphic (per blade) Connector type D-Sub 15-pin
  Resolution 1600x1200@60Hz
  Chipset Aspeed AST2150
I/O ports (per blade) USB (2) ports
  VGA (1) D-Sub 15-pin port
  RJ-45 (1) port, from Pass through module / (1) port, from front panel
System Monitoring (per blade) Chipset Winbond W83793G
  Temperature Monitors temperature for CPU & system environment
  LED Fan fail LED indicator / Over temperature warning indicator
  Others Chassis intrusion detection / Watchdog timer support
Server Management (per blade) Onboard Chipset Onboard Aspeed AST2150
  AST2150 IPMI Feature IPMI 2.0 compliant baseboard management controller (BMC) / USB 2.0 virtual hub / BIOS update
  AST2150 iKVM Feature 24-bit high quality video compression / Dual 10/100 Mb/s MAC interfaces
BIOS (per blade) Brand / ROM size AMI / 8MB
  Feature Multiple boot options / Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring / Auto-configurable of hard disk types
Power Supply Type ERP1U
  Efficiency 80 plus Platinum
  Redundancy 2+1
  Serviceability Hot-swap
  Input Range Full-range AC(100-240V)
  Frequency 50/60 Hertz
  Output Watts 1600 Watts
Regulation FCC (DoC) Class A
  CE (DoC) Yes
Operating Environment Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
  Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
  In/Non-operating Humidity 90%, non-condensing at 35° C
RoHS RoHS 6/6 Compliant Yes
Package Contains Barebone (1) FM65B5519 Barebone
  Heatsink / Cooler (18) CPU heatsinks
  Rail kit (1) sliding rail kit
  Manual (1) Quick Ref. Guide
  Installation CD (1) TYAN installation CD
 
Cable Power Cord
(3) CCBL-0310, US type power cords / (3) CCBL-0300, EU type power cords
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