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The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
intel-server-system-h2312wpqkr
The Intel® Server System H2300WP is the ideal option for high performance computing and data center deployment with its total of 64 DIMMs (two DIMMs per Channel design) for maximum memory and I/O capability. Utilizing the power of the new Intel® Xeon® processor E5-2600 product family, the Intel® Server System H2300WP includes up to 16 PCIe* 3.0 x 16 slots, integrated QDR/FDR InfiniBand*, energy-efficient power, and intelligent system-level management for node and overall system monitoring. Pluggable carrier trays with cable-free power and PCIe* make servicing easy. Intel® I/O Expansion Module or Intel® Remote Management Module 4 upgrades available separately.
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The Intel® Server System R1200GZ family takes full advantage of the new Intel® Xeon® processor E5-2600 product family capabilities with the Intel® Server Board S2600GZ family. The Intel Server System R1200GZ features an energy-efficient spread core design and maximum (768 GB) memory capacity with up to 24 DIMMs. S2600GZ-based rack-optimized server systems deliver unmatched performance, I/O capacity, and flexibility in an expansive family of 1U and 2U systems for the most demanding enterprise data center, cloud, or HPC environments.
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  • Support latest Intel Xeon Processor 5500 series and Intel Core Micro-architecture (Nehalem-EP) Platform
  • Total 12-DIMM slots and high memory scalability for computing-intensive applications
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System Form Factor 2U Rackmount
Gross Weight 29 kg
Feature Four nodes in one chassis
Chassis Model YR292
Dimension (D x W x H) 28.74" x 17.32" x 3.44" (730 x 440 x 87.5mm)
Blade Dimension (D x W x H) 28.74" x 8.46" x 1.61" (730 x 214.8 x 40.8mm)
Motherboard S5518GM2NR
Board Dimension 6.3"x16.4" (160x416.6mm), per blade
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  • Entry 1U dual-socket SMP server platform for most of enterprise and HPC applications
  • Dual LGA1366 sockets support up to (2) Intel® Quad-Core Xeon® Processor 5500 Series
  • Support QPI 6.4/ 5.86/ 4.8 GT/s
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  • Most Cost-Effective, High-Density Server Platform
  • (18) Intel single-socket Xeon E3-1200 or i3-2100 (32nm / 22nm) blades in a 4U enclosure
  • (8) Rear mounted hot-swap chassis cooling fans
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The Micro Server segment is an emerging category which features hot swappable, single-socket processor nodes with higher density and lower power consumption than traditional single server or blade server enclosures. This design features lower cost, reduces energy consumption, conserves space, and minimizes cabling. TYAN’s FM65 Micro Server targets both web and cloud computing applications for the SMB (small to medium sized business) field.